This document describes the features and specifications of the AirPrime Q26 Carrier Board and provides you with the information required to integrate the AirPrime Q26 Carrier Board into your products.

This document describes the features and specifications of the AirPrime Q2687 module and provides you with the information required to integrate the AirPrime Q2687 into your products.

This file is the 3D file for AirPrime Q2686/Q2687 product.

This document aims to provide a guideline for designing applications based on the AirPrime Q26 series of embedded modules (Q26 Extreme, Q2686, Q2687, and Q2698). Recommendations are provided to maximize the compatibility of applications when migrating from one Q26 embedded module to another.

This document summarizes the differences between the Q26 Extreme, the Q2686 and the Q2687.

This document presents guidelines for the industrial assembly of an AirPrime Q Series wireless module on an application.