This document describes the features and specifications of the AirPrime Q26 Carrier Board and provides you with the information required to integrate the AirPrime Q26 Carrier Board into your products.

This document describes the features and specifications of the AirPrime Q2686 module and provides you with the information required to integrate the AirPrime Q2686 into your products.

This file is the 3D file for AirPrime Q2686/Q2687 product.

This document aims to provide a guideline for designing applications based on the AirPrime Q26 series of embedded modules (Q26 Extreme, Q2686, Q2687, and Q2698). Recommendations are provided to maximize the compatibility of applications when migrating from one Q26 embedded module to another.

This document gives recommendations and general guidelines for designing an application using the AirPrime Q2686 wireless module. It also recommends some manufacturers and suppliers for the peripheral devices which can be used with the AirPrime Q2686 wireless module.

This document gives guidelines for the industrial assembly of an AirPrime Q2686 wireless module on an application.

This document gives guidelines for the industrial assembly of AirPrime Q Series modules in an application (Q2686, Q2687, Q2687 Classic, Q26 Extreme, Q26 Elite).

This document summarizes the differences between the Q26 Extreme, the Q2686 and the Q2687.

This document presents guidelines for the industrial assembly of an AirPrime Q Series wireless module on an application.

This document sums up the differences between the Q2686 Refreshed embedded module and the Legacy Q2686. The Q2686 Refreshed is a product enhancement of the Legacy Q2686 with a new RF chip set applied. It aims to extend the product life cycle.