This document presents guidelines for the industrial assembly of an AirPrime HL Series embedded module on an application.

This document presents guidelines for the industrial assembly of the AirPrime Snap-in Socket on an application.

This document describes the features and specifications of the AirPrime HL6528x module and provides you with the information required to integrate the AirPrime HL6528x into your products.

CAD file archive to ease customer hardware design

This document presents guidelines for the handling of solderable AirPrime products as they are moisture/reflow sensitive surface mount devices.

This document describes the features and specifications of the AirPrime Q26 Carrier Board and provides you with the information required to integrate the AirPrime Q26 Carrier Board into your products.

Archive contain CAD files to ease customer hardware design: Pcb file from PADS version 9.3 (CAD software) Ascii file from PADS version 2005.2 (CAD software) Gerber files (Manufacturing files “CAM software”) DXF file (Mechanics file)

This document describes the AirPrime HL Series Development Kit (board version 1400897-I) and how it integrates with the AirPrime HL6528x, HL75xx and HL85xxx series of embedded modules via a specific Snap-in connector.

This file is the 3D file for AirPrime HL6528 product.

This document is an early version of requirements specification for Sierra Wireless NADs (Network Access Devices) products providing eCall functions.