Airlink MP70 LTE-A EOL Notice

AirLink LX40 Verizon, NA Generic & LPWA EOL Notice

AirLink LX60 Verizon, NA Generic & LPWA EOL Notice

Airlink MG90 LTE-A EOL Notice

This document describes the EM9190 Development Kit (PCB board version: 5304831) and how it integrates with EM919x/EM7690 and EM929x embedded modules.

User Guide describing setup and use of the BX310x module development kit.

Product technical specifications for the AirPrime BX310x Bluetooth Module.

This document describes the hardware interface of the HiLo V2 embedded module that connects to the cellular device application and the air interface.

This document describes the features and specifications of the AirPrime HL77xx series of embedded modules and provides you with the information required to integrate it into your products.

This document describes the hardware interface of the HiLo 3G & HiLo3G-D M2M module used to connect the device application and the air interface.

This document describes the hardware interface of the HiLoNC V2 module that connects to the cellular device application and the air interface. The HiLoNC V2 offers new features compared to HiLoNC including digital audio link and RF burst indicator.

This document describes the features and specifications of the AirPrime HL8518, HL8528 and HL8529 modules and provides you with the information required to integrate them into your products.

This document describes the features and specifications of the AirPrime HL7648 embedded module and provides you with the information required to integrate it into your products.

This document describes the features and specifications of the AirPrime HL7618RD embedded module and provides you with the information required to integrate it into your products.

This document describes the features and specifications of the AirPrime MC7455 module and provides you with the information required to integrate the AirPrime MC7455 into your products.

This document describes the features and specifications of the AirPrime MC7430 module and provides you with the information required to integrate the AirPrime MC7430into your products.

This document describes thermal mitigation techniques implemented on AirPrime EM74xx and MC74xx LTE modules.

This document presents guidelines for the industrial assembly of an AirPrime HL Series embedded module on an application.

This document describes the features and specifications of the AirPrime HL7650 embedded module and provides you with the information required to integrate it into your products.

This document describes the features and specifications of the AirPrime HL7518 module and provides you with the information required to integrate it into your products.