This document presents the details regarding the product technical specifications, design, and features of the AirPrime Q26 Elite embedded wireless module and all derivatives.

This document gives guidelines for the industrial assembly of an AirPrime Q2686 wireless module on an application.

This document gives recommendations and general guidelines for designing an application using the AirPrime Q2686 wireless module. It also recommends some manufacturers and suppliers for the peripheral devices which can be used with the AirPrime Q2686 wireless module.

This document presents and defines the AirPrime Q2668 wireless module. The Q2668 is a self-contained GSM/GPRS/EGDE dual-band and TD-HSDPA dual-mode module, footprint compatible with other Q26 series devices.

This document gives guidelines for the industrial assembly of AirPrime Q Series modules in an application (Q2686, Q2687, Q2687 Classic, Q26 Extreme, Q26 Elite).

This document presents and defines the Q26 Extreme embedded module, a multi-mode EDGE 2G/WCDMA 3G/HSxPA solution with dual antenna receive diversity.

This document summarizes the differences between the Q26 Extreme, the Q2686 and the Q2687.

This document presents guidelines for the industrial assembly of an AirPrime Q Series wireless module on an application.

This document provides recommendations and general guidelines to help design a product using New Q24 Series GSM/GPRS wireless modules. The recommendations include design rules and typical implementation examples, mechanical constraints, PCB layout recommendations, test and download recommendations.

This guide addresses issues that affect the integration of AirPrime MC Series (PCI Express MiniCard) embedded modules into host products, and includes design recommendations for the host products.