This file is the latest 3D model release for AirPrime WS6318 product.

This file is the 3D file for AirPrime Q2686/Q2687 product.

This file is the 3D file for AirPrime HL6528 product.

This file is the 3D file for AirPrime HL8548 product.

This file is the latest 3D model for AirPrime HL8548 and HL8548-G product.

This document describes the features and specifications of the AirPrime SL5011 EV-DO Rev A module and provides you with the information required to integrate the AirPrime SL5011 into your products.

This document describes the features and specifications of the AirPrime WS6318 module and provides you with the information required to integrate the AirPrime WS6318 into your products.

This document aims to provide information with migrating applications to the AirPrime MC8704 and MC8705 re-spin modules and only focuses on certification changes since re-spin modules will have the same pin-outs and hardware features as legacy MC8704 and MC8705 modules, and will also be completely firmware compatible.

This document describes how to set up the hardware and software components of Sierra Wireless' PCI Express Mini Card Dev Kit for use with supported AirPrime CDMA, GSM/UMTS, and LTE modules.

This document provides guidelines for designing and implementing an I 2 S interface on the AirPrime SL9090 embedded module.

This document presents guidelines for the industrial assembly of an AirPrime WS6318 Intelligent Embedded Module on an application.

This document describes the features and specifications of the AirPrime WP710x-G embedded module (with variants WP7100-G, WP7102-G and WP7104-G) and provides you with the information required to integrate it into your products.

This document describes the features and specifications of the AirPrime MC8704 module and provides you with the information required to integrate the AirPrime MC8704 into your products.

This document provides guideline for designing applications based on the HiLoNC V2 product. Recommendations are provided to maximize the efficient migration from the AirPrime WISMO2x8 to the HiLoNC V2. This document also defines the differences between both products and provides solutions. This document does not cover all the specifics and characteristics of the HiLoNC V2.

This document aims to provide a guideline for designing applications based on the AirPrime Q26 series of embedded modules (Q26 Extreme, Q2686, Q2687, and Q2698). Recommendations are provided to maximize the compatibility of applications when migrating from one Q26 embedded module to another.

(Document not yet available. To be completed.)

This document describes the features and specifications of the AirPrime Q2698 module and provides you with the information required to integrate the AirPrime Q2698 into your products.

This document describes the features and specifications of the AirPrime WISMO228 module and provides you with the information required to integrate the AirPrime WISMO228 into your products.

This document describes the features and specifications of the AirPrime WISMO218 module and provides you with the information required to integrate the AirPrime WISMO218 into your products.

This document describes the specifications for the Sierra Wireless MC7710 PCI Express Mini Card.