This document presents guidelines for the industrial assembly of an AirPrime WS6318 Intelligent Embedded Module on an application.

This document describes the features and specifications of the AirLink FX Series and provides step by step procedures on how to setup and configure it.

3D CAD Model of the AirLink LS300 Screw in Mounting Bracket in STEP file format

3D CAD Model of the AirLink LS300 DIN Rail Mounting Bracket in STEP file format

This document describes the features and specifications of the AirPrime MC8704 module and provides you with the information required to integrate the AirPrime MC8704 into your products.

This document provides guideline for designing applications based on the HiLoNC V2 product. Recommendations are provided to maximize the efficient migration from the AirPrime WISMO2x8 to the HiLoNC V2. This document also defines the differences between both products and provides solutions. This document does not cover all the specifics and characteristics of the HiLoNC V2.

This document aims to provide a guideline for designing applications based on the AirPrime Q26 series of embedded modules (Q26 Extreme, Q2686, Q2687, and Q2698). Recommendations are provided to maximize the compatibility of applications when migrating from one Q26 embedded module to another.

Detailed Technical Specification of the AirLink LS300

This document describes the features and specifications of the AirLink GL61x0; and provides step by step procedures on how to setup and configure it.

3D CAD Model of the AirLink LS300 in STEP file format

This document describes the features and specifications of the AirPrime Q2698 module and provides you with the information required to integrate the AirPrime Q2698 into your products.

This document describes the features and specifications of the AirPrime WISMO228 module and provides you with the information required to integrate the AirPrime WISMO228 into your products.

This document describes the features and specifications of the AirPrime WISMO218 module and provides you with the information required to integrate the AirPrime WISMO218 into your products.

This document describes the specifications for the Sierra Wireless MC7710 PCI Express Mini Card.

This document describes the specifications for the Sierra Wireless MC7700 PCI Express Mini Card.

This document describes the specifications for the Sierra Wireless MC7750 PCI Express Mini Card.

This document describes how to set up the HiLo 3G Interface Board.

This document contains the description of the packaging of the HiLo modules.

This document describes the hardware interface of the HiLo module that connects to the cellular device application and the air interface.

This document presents technical drawings of the HiLo module and its packaging.