AirPrime - Q26 Series - Development Kit User Guide
- May 9, 2012
- Author: Sierra Wireless
- Version: 8.0
This document describes how the AirPrime Q26 Series Development Kit (motherboard V3.2, reference: 1400666-B) integrates with the AirPrime Q2686, Q2687, Q26 Elite or Q2698 embedded module. It discusses the different interfaces available on the AirPrime Q26 Series Development Kit and provides schematics to facilitate the user’s understanding and configuration of the development kit for their own use.
The AirPrime Q26 Series Development Kit Board may be used to develop both software and hardware applications based on the AirPrime Q26 Series embedded module (Q2686, Q2687, Q26 Elite and Q2698).
Tags
Related items
- AirPrime - Q2686 - Product Technical Specification and Customer Design Guidelines
This document describes the features and specifications of the AirPrime Q2686 module and provides you with the information required to integrate the AirPrime Q2686 into your products.
- AirPrime - Q2687 - Product Technical Specification and Customer Design Guidelines
This document describes the features and specifications of the AirPrime Q2687 module and provides you with the information required to integrate the AirPrime Q2687 into your products.
- AirPrime - Q26 Elite - Product Technical Specification and Customer Design Guideline
This document presents the details regarding the product technical specifications, design, and features of the AirPrime Q26 Elite embedded wireless module and all derivatives.
- AirPrime - Q2698 - Product Technical Specification and Customer Design Guidelines
This document describes the features and specifications of the AirPrime Q2698 module and provides you with the information required to integrate the AirPrime Q2698 into your products.
- Open AT Application Framework
The Open AT Application Framework is a complete software package for embedded M2M application development. It offers a range of readily available building blocks which accelerate the application development process, allowing you to bring connected products to market faster and reduce development costs.